Diamond MT is a class 3 operating, fully functional coating operation with over 25 years of field experience. Our areas of expertise are within the military, commercial, bio-medical, and aerospace technology fields.
Rapid Turnaround
We are committed to serving the industry with rapid turn times for parylene, (normally 10 business days) with expedited service in as little as 2-5 business days depending upon the complexity and quantity. For liquid coatings, our normal turn time is five business days; again with expedite service in as little as 2-3 business day turns. » read more
Quality Assured
Diamond MT's quality manual ensures every employee is focused on continuous improvement and service excellence. Our ESD safe facilities stretch over 12,000 square feet dedicated to your conformal coating requirements. We are continually researching and updating our equipment to make sure we are providing the best ESD protection available. » read more
Parylene Coating Removal
Parylene Coating Removal can be broken down into three categories for removal of parylene coating:
1) Thermal
The thermal parylene coating removal technique (including using a soldering iron to burn through the conformal coating) is the least recommended technique of coating removal. Most conformal coatings require a very high temperature and/or long exposure times. This, in turn, can cause discoloration, leave residues, and adversely effect solders and/or other materials used in the construction of the board from boards. Also, temperature-sensitive components may be damaged. Extreme caution must be taken when burning through conformal coating because some coatings emit very toxic vapors that are hazardous to the people doing the stripping and those around them.
2) Mechanical
Mechanical removal techniques include cutting, picking, sanding or scraping the area of parylene coating to be removed. However, most types of parylene coatings are very tough to remove using this method making the probability of damage to the board very high.
3) Abrasion
The micro abrasive blasting technique offers a fast, cost-effective, easy to control and environmentally friendly non-solvent based method to remove conformal coatings. The system can remove parylene conformal coatings from a single test node, an axial leaded component, a through-hole integrated circuit (IC), a surface mount component (SMC) or an entire printed circuit board (PCB).In the micro abrasive blasting process, a precise mixture of dry air or an inert gas and an abrasive media is propelled through a tiny nozzle attached to a stylus which is either handheld or mounted on an automated system. This allows the mixture to be pinpointed at the target area of the parylene coating to be removed. A vacuum system continuously removes the used materials and channels them through a filtration system for disposal. The process is conducted within an enclosed anti-static chamber and features grounding devices to dissipate electrostatic potential.